| 摘要 |
An ultra-small LED(Light Emitting Diode) package and a manufacturing method thereof are provided to reduce a package size and to simplify manufacturing processes by removing substrate embedding a LED chip from the package. The ultra-small LED package(30) includes an epoxy insulating body, a gold plating layer and an LED chip. The epoxy insulating body(32) is formed like a hexahedron type structure and is transparent. The gold plating layer(31) is transcribed onto at least one plane of the epoxy insulating body and is composed of at least two regions insulated from each other. The LED chip is electrically bonded to the gold plating layer and is embedded in the epoxy insulating body.
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