SEMICONDUCTOR DEVICE AND PACKAGE, AND METHOD OF MANUFACTURE THEREFOR

摘要

A semiconductor package is provided to prevent solder from flowing to an exposed section exposed to a cutting surface formed in a package when a semiconductor device is installed in an external circuit by forming an isolation part made of resin between an electrode surface of a terminal and the exposed section. A semiconductor package is buried in resin. A plurality of outer circumferential leads(5) are arranged in the outer peripheral part of the bottom of the semiconductor package to be electrically connected to a substrate. A plurality of inner circumferential leads(4) are arranged in the peripheral part of a stage(3) for supporting a semiconductor chip(2), extended from the stage. The stage is separated upwardly from the bottom of the semiconductor package. The lower surface of the front end of the inner circumferential lead is exposed to the bottom of the semiconductor package. The inner circumferential lead includes a wire bonding part and a slope part. A wire for electrical connection with the semiconductor chip is bonded to the upper surface of the front end of the wire bonding part. The slope part is slantingly extended downward from the stage and is connected to the wire bonding part. All of the inner circumferential leads are located at a common potential.