| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low-cost package for housing a light emitting element which can effectively radiate the heats generated by a semiconductor light emitting element. <P>SOLUTION: In the sheet array type package 10 for housing a light emitting element, many light emitting semiconductor elements 12 are mounted on a substrate 11, and a reflector 14 for reflecting a light on a wall surface by surrounding these light emitting semiconductor elements 12 is bonded with the substrate 11. The substrate 11 is directly bonded with a circuit copper plate 16 mounting a wiring circuit on the top side of a ceramic substrate 15 and the solid copper plate 18 calcined on the bottom side of the ceramic substrate 15 to directly bonding the ceramic substrate 15 in the DBC method or another active metal brazing filler bonding method. The substrate 11 is bonded with the reflector 14 through the circuit copper plate 16 using a bonding material 19 made up of a glass or a brazing filler metal material. The area of the circuit copper plate 16 viewed from a plane surface is larger than that occupied by the reflector 14. <P>COPYRIGHT: (C)2007,JPO&INPIT |
