发明名称 PACKAGE FOR MOUNTING LIGHT-EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To manufacture a package for mounting a light-emitting element, which package improves the gloss of a light reflection surface, by a simple method. <P>SOLUTION: A package body 11 is formed of a high-temperature baked ceramics, such as alumina and aluminum nitride, and has a cavity 13. A substrate metalized layer 18 made of such a metal showing a high melting point as tungsten and molybdenum is baked on the peripheral side face of the cavity 13 simultaneously with the package body 11. Subsequently, a gloss nickel plating layer 19 is formed on the substrate metalized layer 18, and a gloss silver plating layer 20 is further formed on the gloss nickel plating layer 19, where the surface of the silver plating layer 20 serves as a light reflection surface 21. In forming the gloss nickel plating layer 19 and the silver plating layer 20, a conventional plating method is employed except a process of adding a brightener to a nickel plating solution and to a silver plating solution. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006295011(A) 申请公布日期 2006.10.26
申请号 JP20050116369 申请日期 2005.04.14
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 HONDA TAKAHIKO;NAKASU KOICHI
分类号 H01L33/60 主分类号 H01L33/60
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