EVALUATION METHOD OF SEMICONDUCTOR WAFER, EVALUATION DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide an evaluation method of nano topography on the surface of a semiconductor wafer, an evaluation system, and a manufacturing method of a semiconductor wafer wherein the surface of the nano topography is favorable. SOLUTION: The method of evaluating the nano topography of the surface of the semiconductor wafer cut from a semiconductor ingot is carried out such that a surface shape in a cutting direction is measured before polishing the wafer surface at least, the maximum inclination value of the curvature of a wafer surface is obtained from the sectional shape in the cut direction of the measured surface shape, and the nano topography of a wafer surface after polish is evaluated by this acquired maximum value. COPYRIGHT: (C)2007,JPO&INPIT