发明名称 |
Verfahren und Vorrichtung zum Ätzen von scheibenförmigen Teilen |
摘要 |
Disclosed are a method and apparatus for etching disk-shaped members, especially a method and apparatus for etching semiconductor wafers. In a method wherein wafers (30) are rotated and etched in an etching chamber (12) which is filled with an etching solution, a non-rotating cell plate (26) is disposed between two rotating wafers (30). In an etching apparatus wherein multiple wafers (30) are supported and rotated by a rod (16), the cell plate (26) is disposed between each two wafers (30). The cell plate (26) has a surface area roughly equivalent to that of the wafer (30). |
申请公布号 |
DE112004001425(T5) |
申请公布日期 |
2006.10.26 |
申请号 |
DE20041101425 |
申请日期 |
2004.07.29 |
申请人 |
KOMATSU DENSHI KINZOKU K.K. |
发明人 |
MIYAZAKI, TADAMITSU;HIRAYAMA, KAZUYA;FUKUNAGA, HISAYA;FUTAMURA, HIROYASU |
分类号 |
H01L21/306;H01L21/00;H01L21/673 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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