发明名称 WIRING STRUCTURE OF PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ACTUATOR, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide wiring structure of a piezoelectric element reducing load to an electrode part, a piezoelectric actuator having this wiring structure, and electronic equipment. <P>SOLUTION: A positive electrode wiring part 21, a negative electrode wiring part 23, and a grounding wiring part 25 are formed of first to third insulation layers 27-29 and first to third conductive layers 31-33 having high elastic modulus. Thus, lowering of vibration characteristics and flexing factor of the first and second piezoelectric elements 13, 15 can be reduced caused by formation of the positive electrode wiring part 21, negative electrode wiring part 23, and grounding wiring part 25. Conductive paste can be cured by locally heating it by a heat light source like laser beam, therefore, the paste can be adhered to first-fourth positive electrode parts A1-A4 and first-fourth negative electrode parts B1-B4 without having affect on polarization performance of the first and second piezoelectric elements 13, 15. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006289217(A) 申请公布日期 2006.10.26
申请号 JP20050111221 申请日期 2005.04.07
申请人 SEIKO EPSON CORP 发明人 NAKAJIMA SATOSHI
分类号 B06B1/06;H02N2/00 主分类号 B06B1/06
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