发明名称 MOLD AND EJECTOR UNIT USED FOR IT
摘要 PROBLEM TO BE SOLVED: To change the specifications of a mold device 10 for molding of new specifications in a short time. SOLUTION: In the mold device 10 for molding, a set of a cavity plate 220 and a core 240 and a third plate 340 (sprue plate) having a plurality of third sprues 342 connected to a space formed by the cavity plate 220 and the core 240 through gates 224 are provided. The third sprues 342 are arranged in the circumferential direction of a circuit, and each of the third sprues 342 is a long hole extended in the diameter direction of the circuit. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006289752(A) 申请公布日期 2006.10.26
申请号 JP20050112879 申请日期 2005.04.08
申请人 SEIKO EPSON CORP 发明人 KINOSHITA MAYUMI;NAKAMURA KAZUHIDE
分类号 B29C45/26 主分类号 B29C45/26
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