| 发明名称 |
Electronic components |
| 摘要 |
A method of manufacturing an electronic component comprising at least one n- or p-doped portion, comprising the steps of: co-depositing inorganic semi-conducting nanoparticles and dopant on a substrate, the nanoparticles being a group four element such as silicon or germanium; fusing the nanoparticles by heating to form a continuous layer; and subsequently; and, recrystallising the layer.
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| 申请公布号 |
US2006237719(A1) |
申请公布日期 |
2006.10.26 |
| 申请号 |
US20030533291 |
申请日期 |
2003.10.30 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
COLFER PAUL;BYRNE LORRAINE;CAHILL EUGENE;KEENAN PHIL;STOBIE NIALL |
| 分类号 |
H01L29/04;C23C26/02;C23C30/00;H01L21/20;H01L21/208;H01L21/268;H01L21/336;H01L29/786;H01L51/40 |
主分类号 |
H01L29/04 |
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