| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the size of a conventional charge pump-type booster circuit. <P>SOLUTION: The surface mount booster circuit is constructed by providing electrodes over the upper face of a laminated ceramic substrate constructed of three or more capacitors, mounting IC for a booster circuit over the laminated ceramic substrate, electrically connecting the capacitors and the IC for the booster circuit with each other through the above electrodes over the laminated ceramic substrate, also providing an electrode over at least a side face of the laminated ceramic substrate, and sealing the IC for the booster circuit with a resin. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
