| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a head gimbal assembly that, even in sucking an extremely small solder ball, is capable of transporting solder balls to the connecting terminal of a slider and a suspension without taking out excess solder balls. SOLUTION: In the method for manufacturing a head gimbal assembly, the solder ball discharged from the opening of a solder ball feeder storing the solder balls is held, wherein a distance of the solder ball from the opening side end to the opening is just enough for a solder ball stuck to the solder ball so held to return to the solder ball feeder. In this state, a gas is blown against between the stuck solder ball and the opening, detaching the stuck solder ball, arranging the held solder ball to a position in contact with a connecting terminal on the face of the gimbal and one on the face of the slider fixed to the gimbal, and making the arranged solder ball reflow to connect the connecting terminals to each other. COPYRIGHT: (C)2007,JPO&INPIT
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