POLYIMIDE FILM LAMINATE

摘要

Disclosed is a polyimide film laminate composed of an aromatic polyimide layer and a metal layer. This polyimide film laminate is formed by spreading a polyamic acid solution composition over a metal foil and imidating the polyamic acid thereon. The polyamic acid solution composition contains 3,3',4,4'-biphenyltetracarboxylic acid dianhydride as an essential tetracarboxylic acid dianhydride component, while being added with a specific diamine component. This polyimide film laminate is excellent in gas permeation rate and water vapor permeation rate, while having heat resistance, high elastic modulus and low linear expansion coefficient. Further, foaming or separation is suppressed in a high-temperature step of the production process of this polyimide film laminate.