| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser equipment capable of providing a stable characteristics for an extended period by reducing a remaining stress of a semiconductor laser element with improved heat radiation characteristics. SOLUTION: The semiconductor laser equipment comprises a semiconductor laser element 10 which has facing first surface 10a and second surface 10b and emits beam in the direction orthogonal to the facing direction of the first surface 10a and second surface 10b, a first support member 31 which is arranged on the first surface 10a of the semiconductor laser element 10 through a first welding layer 41, and a second support member 32 of the material different from the first support member 31 which is arranged on the second surface 10b of the semiconductor laser element 10 through a second welding layer 42. COPYRIGHT: (C)2007,JPO&INPIT |
