SUBSTRATE FOR POWER MODULE AND ITS PRODUCTION PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a substrate for power module in which heat dissipation performance and durability are enhanced.

SOLUTION: The substrate 1 for power module comprises: an insulating circuit board 10; a heat sink 20; and a restriction member 30. The insulating circuit board 10 comprises: a wiring layer 11 mounting a power device 7; an insulating substrate 12 bonded to the rear surface of the wiring layer 11; and a heat dissipation layer 12 bonded to the rear surface of the insulating substrate 12. The heat sink 20 is bonded to the rear surface side of the insulating circuit board 10, and a channel 20a for conducting cooling medium 29 is formed internally so that heat of the power device 7 is dissipated. The restriction member 30 is bonded to the rear surface of the heat sink 20 and restricts warping of the heat sink 20 due to difference in linear expansion coefficient between the insulating substrate 12 and the heat sink 20.

COPYRIGHT: (C)2007,JPO&INPIT