| 摘要 |
PROBLEM TO BE SOLVED: To provide a rigid flex multilayer printed-wiring board which can avoid formation of a rough surface of a rigid part even when an adhesive sheet having less resin flow is used upon lamination, and also to provide a method for manufacturing the board. SOLUTION: In the rigid flex multilayer printed-circuit board comprising a rigid part and a partially-bendable flex part, at least an insulating adhesive layer to be laminated on the rigid part of the flex board includes an adhesive sheet having less resin flow upon the lamination, and the sheet is laminated on its flat surface. COPYRIGHT: (C)2007,JPO&INPIT |
