发明名称 METHOD AND APPARATUS FOR DEPOSITING FILM, AND METHOD FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus for depositing a film with high yield, and to provide a method for processing a substrate. SOLUTION: The method for depositing a film 8 by coating a substrate 7 with a fluid film deposition material comprises a step for coating the substrate 7 with a film deposition material, a heat treatment step for obtaining a film 8 by heating and drying the film deposition material, and a step for detecting stress of the film 8 and reheating at least a part of the film 8 based on the detected stress to adjust the stress uniformly. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006294812(A) 申请公布日期 2006.10.26
申请号 JP20050112446 申请日期 2005.04.08
申请人 SEIKO EPSON CORP 发明人 SEKI SHINSUKE
分类号 H01L21/316;B05C5/02;B05C9/14;B05D3/00;B05D3/02 主分类号 H01L21/316
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