发明名称 |
Method of manufacturing multi-layered substrate |
摘要 |
A method of manufacturing a multi-layered substrate includes providing an electronic component on a surface of a substrate so that a terminal of the electronic component faces upward. The method also includes providing a first insulation pattern on the surface so as to fill a step generated due to a thickness of the electronic component.
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申请公布号 |
US2006240664(A1) |
申请公布日期 |
2006.10.26 |
申请号 |
US20060396255 |
申请日期 |
2006.03.31 |
申请人 |
WADA KENJI;ITO HARUKI;IMAI HIDEO |
发明人 |
WADA KENJI;ITO HARUKI;IMAI HIDEO |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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