Wafer testing method, involves positioning electrical contacts and mating contacts with respect to one another with assistance of optical detection of contact-making apparatus and unit under test

摘要

The method involves placing one marking, which is a defined position with respect to one of electrical contacts (7), on a contact-making apparatus (1). The marking is detected optically for position determination. The electrical contacts and the mating contacts (13) are positioned with respect to one another with assistance of an optical detection of the contact-making apparatus and the unit under test e.g. wafer (10). The unit under test is moved relative to the contact-making apparatus for an alignment of the contact-making apparatus and the unit under test. Independent claims are also included for the following: (1) an apparatus for carrying out a method of electrical testing of a unit under test (2) a method for production of a contact-making apparatus.