Electronic component mounting device for manufacturing electronic assembly, has press detention connection formed between electronic component and mounting part by pressing electronic component at mounting part

摘要

The device has an electronic component (1) that is fastened at a mounting part (2) e.g. printed circuit board and component carrier. A press detention connection is formed between the electronic component and the mounting part by pressing the electronic component at the mounting part. The press detection connection is a metal semiconductor press detention connection is electroconductive. An independent claim is also included for a method of mounting an electronic component on a mounting part for manufacturing an electronic assembly.