| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device capable of preventing leakage of memory data from a signal exposed on the upper part. <P>SOLUTION: The semiconductor integrated circuit device, in which a plurality of packages 102, 104, 106, 108 are laminated, is provided with a security chip 107, a security cover 110 attached on the laminated packages 102, 104, 106, 108, and data protection wiring 110 for security signal transmission. The security chip 107 transmits a signal to the data protection wiring 110, and compares a signal returned through the data protection wiring 110 with the original signal. Then, on the basis of the comparison result, elements in the plurality of packages 102, 104, 106, 108 are deactivated. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
