发明名称 Immersion lithography process, and structure used for the same and patterning process
摘要 An immersion lithography process is described. First, a photoresist layer on a material layer is formed. Then, an acid compensation layer is formed on the photoresist layer. An immersion exposure step is performed on the acid compensation layer and the photoresist layer. The acid compensation layer contains a photo-acid generator with a concentration of the photo-acid higher than that produced by a photo-acid generator in the photoresist layer after the immersion exposure step. Then, a development step is performed to pattern the acid compensation layer and the photoresist layer.
申请公布号 US2006238727(A1) 申请公布日期 2006.10.26
申请号 US20050112105 申请日期 2005.04.21
申请人 TSAI KAO-TSAIR;OUE JAN-NAN 发明人 TSAI KAO-TSAIR;OUE JAN-NAN
分类号 G03B27/48 主分类号 G03B27/48
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