| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device where a solder bonding failure can be prevented without deteriorating heat and cold resistance, and to provide the manufacturing method of the electronic circuit device. SOLUTION: A semiconductor package 10 is provided with a molded body 11, lands 12, an insulating film 13, and solder materials 15 (filling solder 15a and solder ball 15b). The molded body 11 is provided with an insulating film 13 where metallic particles 14 of relay materials 14a are dispersed on a face confronted with a printed board 20. The insulating film 13 is provided with a plurality of through-holes 16 in positions corresponding to the lands 12 and they are filled with filling solder 15a. A plurality of solder balls 15b are formed on an exposed face of filling solder 15a. The printed board 20 is provided with a substrate 21 where a plurality of through-holes 22 and lands 23 are formed. The semiconductor package 10 is placed on the printed board 20 so that the solder balls 15b and the lands 23 are bonded in the through-holes 22. COPYRIGHT: (C)2007,JPO&INPIT |
