发明名称 Method of manufacturing insulated gate semiconductor device
摘要 A gate electrode includes a first polysilicon film remaining on a first oxide film, a part of a second polysilicon layer 8 superimposed on the polysilicon layer, and a part of the second polysilicon layer partially extending over second gate oxide films. Thus, the thickness of the gate electrode on the first gate oxide film is the same as that of the gate electrode of the prior art, but the film thickness t 2 of the gate electrode 10 on the second gate oxide films 6 A and 6 B is thinner than the thickness t 1 of the prior art. Therefore, the height gap h 2 between the gate electrode 10 and the N+type source layer 11 and the height gap h 2 between the gate electrode 10 and the N+type drain layer 12 become smaller compared to those of prior art, leading to the improved flatness of the interlayer oxide film 13.
申请公布号 US7125787(B2) 申请公布日期 2006.10.24
申请号 US20030720378 申请日期 2003.11.25
申请人 SANYO ELECTRIC CO., LTD. 发明人 SEKIKAWA NOBUYUKI;MOMEN MASAAKI;ANDOH WATARU;HIRATA KOICHI
分类号 H01L21/28;H01L21/3205;H01L21/336;H01L21/4763;H01L29/423;H01L29/43;H01L29/49;H01L29/76;H01L29/78 主分类号 H01L21/28
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