| 摘要 |
According to various embodiments, there is a method of inspecting semiconductor wafers comprising comparing a value for each wafer in a lot of wafers to a mathematical model, where the values include data about at least one feature on the wafers, and where the mathematical model comprises a threshold value corresponding to the at least one feature, and further where values greater than the threshold value comprise an indication of a spin defect. The method can also comprise determining whether any of the values of the wafers in the lot are not greater than the threshold value, grouping into a group (P) those wafers whose values are not greater than the threshold value, and flagging for further inspection those wafers having values greater than the threshold value.
|
