发明名称 |
Stress Reducing Stiffener Ring |
摘要 |
An electronic structure and associated method of formation. A laminate is solderably coupled to an electronic carrier. A stiffener is adhesively attached to a portion of a surface of the laminate by a stiffener adhesive that is in physically adhesive contact with a portion of a first surface of the stiffener and with the portion of the surface of the laminate. A thermal lid is adhesively attached to a portion of a second surface of the stiffener by a lid adhesive that is in physically adhesive contact with a portion of a surface of the lid and with a portion of the second surface of the stiffener. A void region is disposed between the surface of the thermal lid and the surface of the laminate. |
申请公布号 |
KR100637773(B1) |
申请公布日期 |
2006.10.24 |
申请号 |
KR20030063539 |
申请日期 |
2003.09.15 |
申请人 |
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发明人 |
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分类号 |
B42D15/10;G06K19/077;H01L23/00;H01L23/10;H01L23/12;H01L23/16;H01L23/31;H01L23/36 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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