发明名称 Protecting resin-encapsulated components
摘要 A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
申请公布号 US7125429(B2) 申请公布日期 2006.10.24
申请号 US20040759312 申请日期 2004.01.19
申请人 KEMET ELECTRONICS CORPORATION 发明人 MELODY BRIAN JOHN;KINARD JOHN TONY;PERSICO DANIEL F.;STOLARSKI CHRIS;LESSNER PHILLIP MICHAEL;CHEN QINGPING;PRITCHARD KIM;HARRINGTON ALBERT KENNEDY;WHEELER DAVID ALEXANDER
分类号 H01G9/00;H01G9/012;H01L23/495 主分类号 H01G9/00
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