| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocompression apparatus capable of automatically adjusting a display size and a size of a semiconductor device mounted on the display even when these sizes and positions of the same are different, and capable of highly accurate thermocompression without suffering from variations of temperature and pressurizing force of the thermocompression. SOLUTION: In a state where a plurality of driver circuits 2 are temporarily pressure bonded to a display panel 1, a thermocompression unit 20 equipped with a pressure head 23b of a thermocompression block 23 and a pad 24 is divided for every driver circuit 2 for thermocompression bonding. Position adjustment of the individual thermocompression unit is performed by constructing unit position adjusting means 30, pushing up a friction plate 31 for fixing the thermocompression unit 20 by a pusher 38 provided on an air cylinder 33, separating the plate from a support table 10, and moving it along a guide rail 11. COPYRIGHT: (C)2007,JPO&INPIT
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