ELECTRONIC COMPONENT MODULE

摘要

This invention provides an electronic component module comprising a laminated ceramic electronic component as a first electronic component and a circuit board as a second electronic component electrically connected to each other through a bonding material of an electrically conductive adhesive such as an electrically conductive resin material. An organic compound which lowers the work function of the electrode surface, for example, an amine compound free from an oxygen atom in its branched skeleton and containing a nitrogen atom, such as tetraethylenepentamine, triethylamine, tri-n-butylamine, or 1-aminodecane, is previously adsorbed onto a surface layer of an external electrode in the laminated ceramic electronic component and an electrode pad in the circuit board. According to the above constitution, the work function of the electrode surface can be reduced to increase a Schottky current, the resistance derived from connection between the electrode and a connecting material can be reduced, and an electronic component module having high electrical connection reliability can be realized.