发明名称 APPARATUS FOR SECURING LIGHT EMITTING DIODE CHIPS TO BE TESTED
摘要 An apparatus for fixing a tested LED chip is provided to simply fabricate a process for supplying package environments to an LED chip by supplying package environments to a tested LED chip without an encapsulation process using resin and so forth. A tested LED chip(102) is supported by the upper part of a pillar-type main body(110) wherein a base part(116) extending in the outer circumferential direction is formed on the lower part of the main body. An airtight transparent cover(170) is detachably coupled to the base part of the pillar-type main body to supply a predetermined space to the circumference of the main body. An electrical connection unit(130) is so disposed to supply power to the LED chip. The power supplied through the electrical connection unit is supplied to the LED chip by a chip fixing unit(150). The pillar-type main body can be made of metal. The cover can have an edge detachably coupled to the base part of the main body.
申请公布号 KR100638817(B1) 申请公布日期 2006.10.19
申请号 KR20050041783 申请日期 2005.05.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, SANG HYUN;CHOI, SEOG MOON;PARK, JI HYUN;KIM, HYUN HO
分类号 H01L33/00 主分类号 H01L33/00
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