| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can be patterned by exposure to active rays such as UV rays and has higher adhesion to a wafer, a glass substrate or an organic substrate as a substrate compared to a conventional electronic/electric insulating material, and excellent liquid repelling property. <P>SOLUTION: The positive photosensitive resin composition comprises (A) an alkali-soluble phenolic resin, (B) an amide acid polymer expressed by general formula (1), (C) a naphthoquinone diazide compound, (D) a polyfunctional methylol compound, and (E) a solvent which dissolves the above (A) to (D) components, wherein the component (B) and/or the component (D) contains a fluorine atom. <P>COPYRIGHT: (C)2007,JPO&INPIT |
