| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a halogen-free flame retardant composition for a solder resist having both high flame retardancy and flexibility and excellent also in resistance to the heat of soldering, moisture resistance and high-temperature reliability. <P>SOLUTION: The flame retardant composition for a solder resist contains: an alkali-soluble resin (A) containing at least one kind of carboxyl group-containing epoxy (meth)acrylate (A1) obtained by reacting an epoxy resin (a) having two or more epoxy groups within a molecule with an unsaturated group-containing monocarboxylic acid (b) and a polybasic acid anhydride (c) or at least one kind of urethane (meth)acrylate (A2) having carboxyl groups; a compound (B) having an ethylenically unsaturated group within a molecule; a photopolymerization initiator (C); a phosphorus-containing epoxy resin (D) of a specific structure; and a hydrated metal compound (E). The composition is suitable for use as a solder resist for an FPC or as a cover lay film. <P>COPYRIGHT: (C)2007,JPO&INPIT |
