发明名称 ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To eliminate defects (1) that an electric conductivity between each bonded layer is not good because the bonded layers of each of an internal conductor and an external conductor use electrode materials such as Cr, NiCr or the like in the case of a technology mentioned in a conventional patent literature 1, and (2) that an insulating material of an internal electrode layer and an internal conductive material are restricted because the internal conductor and the exterior conductor of the electronic part are connected by burning, or the like. SOLUTION: The electronic part 10 has the internal conductor 14 which is built in an insulating layer 13 of an electronic part element assembly 10A, the external conductor 15 which is electrically connected to the end face of the internal conductor 14 at the end face of the electronic part element assembly 10A, and a conductive pad 18 which interposes between these conductors so as to connect the end face of the internal conductor 14 and the external conductor 15 and is comprised of the same materials as ones for the internal conductor 14. The area of the conductive pad 18 is formed so as to be larger than the area of the end face of the internal conductor 14, and so as to be smaller than the area of the external conductor 15. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006287063(A) 申请公布日期 2006.10.19
申请号 JP20050106810 申请日期 2005.04.01
申请人 MURATA MFG CO LTD 发明人 MATSUDA KATSUJI;MATSUNAGA MINORU;KAWAGUCHI MASAHIKO
分类号 H01F27/29;H01G4/30 主分类号 H01F27/29
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