| 发明名称 |
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME |
| 摘要 |
To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type wafer level package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.
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| 申请公布号 |
US2006231958(A1) |
申请公布日期 |
2006.10.19 |
| 申请号 |
US20060456141 |
申请日期 |
2006.07.07 |
| 申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY, INC. |
发明人 |
YANG WEN-KUN |
| 分类号 |
H01L23/12;H01L23/52;H01L21/44;H01L21/48;H01L21/50;H01L21/58;H01L21/60;H01L23/00;H01L23/14;H01L23/31;H01L23/48;H01L23/485;H01L23/522;H01L23/538;H01L23/552;H01L25/065 |
主分类号 |
H01L23/12 |
| 代理机构 |
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