| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance processing capability of a plasma processing device for jetting a processing gas from a blowout port through a discharge space and for exposing a processing object to the jetted gas while relatively moving it with respect to the discharge space. <P>SOLUTION: This plasma processing device 1 is provided with a plasma generation unit 10 including a pair of electrodes 11 and 12 for forming the discharge space 14. The plasma generation unit 10 has a processing object-faced surface 170 to be faced to the processing object 90, and the blowout port 16 is opened in the processing object-faced surface 170. A part 171 on the forward side in the processing object movement direction in the processing object-faced surface 170 by interposing the blowout port 16 is longer than a part 172 on the backward side. <P>COPYRIGHT: (C)2007,JPO&INPIT |
