| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate of a semiconductor apparatus with which a burr that occurs in an opening formed in the substrate is prevented and sealing resin leakage from a metallic mold is prevented when sealing resin. SOLUTION: A bonding pad 22 and a conductor pattern/outer connection terminal pad 26 are formed on one face side of a resin substrate 20 by electrolytic plating for supplying power from a plating conductor pattern. A recess is formed where the pads 22 and 26 are exposed. A solder resist layer 30 where a substrate face is formed between the opening 12 and a peripheral edge of the opening 12, and the edge of the bonding pad 22 is removed. The substrate face is covered with a mask 31. Desired plating layers 27b and 27a are formed on respective exposure faces of the bonding pad 22 and the outer connection terminal pad 26 by electrolytic plating. The mask 31 is removed and the plating conductor pattern is removed by etching. The opening 12 is formed by a router. COPYRIGHT: (C)2007,JPO&INPIT |
