PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

This invention provides a process for producing a spacerless stacked package-type semiconductor device, which is simple in process and is low in cost, and a semiconductor device. This semiconductor device has a structure comprising a substrate, a face-up-state first semiconductor element connected by wire bonding to the substrate through a gold wire, and a second semiconductor element stacked onto the first semiconductor element. This semiconductor device is produced by interposing an epoxy resin composition having a silica content of 50 to 80% by mass in a semi-melted state having a viscosity in the range of 1 to 60 Pa·s into between the first semiconductor element and the second semiconductor element to form a 10 to 300 µm-thick adhesive layer and thus to bond the first semiconductor element and the second semiconductor element to each other, covering a part of the gold wire connected to the first semiconductor element, and then heating the adhesive layer to cure the adhesive layer.