发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR LIGHT SHIELDING FILM, METHOD FOR FABRICATING LIGHT SHIELDING FILM, TRANSFER MATERIAL, AND METHOD FOR MANUFACTURING TRANSFER MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a light shielding film, with which high black density is obtained in a thin film state, which is excellent in a light shielding property and in a heat curing property after exposure, and with which high resolution image can be formed. <P>SOLUTION: The photosensitive resin composition for the light shielding film contains metal particles and/or metal compound particles as a black colorant, together with a binder resin, a photo-acid generator and a cross-linking agent. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006284947(A) 申请公布日期 2006.10.19
申请号 JP20050105150 申请日期 2005.03.31
申请人 FUJI PHOTO FILM CO LTD 发明人 NAKAMURA HIDEYUKI
分类号 G02B5/20;B05D1/26;G03F7/004;G03F7/038 主分类号 G02B5/20
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