FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

摘要

A solder resin composition (6) including a solder powder (5a) and a resin (4) is placed on a first electronic component (2), and a connecting terminal (3) of the first electronic component (2) and an electrode terminal (7) of a second electronic component (8) are arranged to face each other. The first electronic component (2) and the solder resin composition are heated to have a gas spouted from a gas generating source (1) included in the first electronic component (2), and the gas (9a) is permitted to flow in a convective manner in the solder resin composition (6). Thus, the solder powder (5a) is flowed in the solder resin composition (6), self-collected on the connecting terminal (3) and the electrode terminal (7), and the connecting terminal (3) and the electrode terminal (7) are electrically connected. The flip chip mounting method by which the electrode terminal of the semiconductor chip wired at a narrow pitch and the connecting terminal of the circuit board can be connected with a high connecting reliability, and the bump forming method for mounting the semiconductor chip on the circuit board are provided.