发明名称 SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND SUBSTRATE FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in performance and reliability by making clear the relationship between an AlN buffer layer and the performance and reliability of a GaN-based FET, its manufacturing method, and a substrate for manufacturing the semiconductor device. SOLUTION: The semiconductor device is provided with the substrate (10), the buffer layer (12) formed on the substrate (10) and composed of aluminum nitride having a film thickness of 5-40 nm, an operation layer (20) formed on the buffer layer (12) and composed of a gallium nitride-based semiconductor, and a control electrode (26) provided on the operation layer (20). Its manufacturing method, and the substrate for manufacturing the semiconductor device are provided. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006286741(A) 申请公布日期 2006.10.19
申请号 JP20050101823 申请日期 2005.03.31
申请人 EUDYNA DEVICES INC;FUJITSU LTD 发明人 YOKOYAMA MITSUNORI;IMANISHI KENJI;YOSHIKAWA SHUNEI
分类号 H01L29/812;H01L21/338;H01L29/778 主分类号 H01L29/812
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