发明名称 |
SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND SUBSTRATE FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in performance and reliability by making clear the relationship between an AlN buffer layer and the performance and reliability of a GaN-based FET, its manufacturing method, and a substrate for manufacturing the semiconductor device. SOLUTION: The semiconductor device is provided with the substrate (10), the buffer layer (12) formed on the substrate (10) and composed of aluminum nitride having a film thickness of 5-40 nm, an operation layer (20) formed on the buffer layer (12) and composed of a gallium nitride-based semiconductor, and a control electrode (26) provided on the operation layer (20). Its manufacturing method, and the substrate for manufacturing the semiconductor device are provided. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2006286741(A) |
申请公布日期 |
2006.10.19 |
申请号 |
JP20050101823 |
申请日期 |
2005.03.31 |
申请人 |
EUDYNA DEVICES INC;FUJITSU LTD |
发明人 |
YOKOYAMA MITSUNORI;IMANISHI KENJI;YOSHIKAWA SHUNEI |
分类号 |
H01L29/812;H01L21/338;H01L29/778 |
主分类号 |
H01L29/812 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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