| 摘要 |
PROBLEM TO BE SOLVED: To reduce irregularity of a heat radiation effect and to improve cooling performance by improving adhesiveness with the upper surface of a heater since a heat sink device can be fixed, while a radiator keeps a parallel degree easily following the upper surface of the heater such as a CPU while freely moving with the pressing point of a pressing part of a fixing tool as a fulcrum. SOLUTION: The heat sink device is provided with a heat reception integrated pump 5 and the fixing tool 1. The fixing tool 1 is provided with a pressing part 2 forming an applying point of pressing loading, a connection part 3 having the pressing part 2 arranged nearly in its center, and one or more supporting parts 4 which is connected with the outer periphery side of the connection part 3 and the other side of each which is connected with a substrate, a casing or a holding member. In order to make the pump 5 parallel to the upper surface of the CPU 6, the fixing tool 1 presses the center of the pump 5. COPYRIGHT: (C)2007,JPO&INPIT
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