Smart-cut of a thin foil of poruous Ni from a Si wafer

摘要

The present invention is a method of fabricating a self-peeling nickel foil from a silicon wafer. The method includes forming a template of silicon by electrochemically etching a portion of the Si wafer to create a porous Si portion with pores of a desired depth. Then electrolessly plating nickel into the template, wherein the porous silicon portion is converted into a porous nickel portion and continuing the electroless plating until the internal tensile stress at an interface of the porous nickel portion and the silicon wafer is great enough to self-peel the porous nickel portion from the silicon wafer creating a nickel foil.