WINDOW MANUFACTURE METHOD OF SEMICONDUCTOR PACKAGE TYPE PRINTED CIRCUIT BOARD

摘要

Window manufacture method of semiconductor package type printed circuit board of the present invention comprises an imaging step to expose to outer as pressing a dry film, excepts a bond finger part is formed in both sides of bronze coated circuit board, an etching step to be formed bond finger to get rid of bronze of exposed the imaging step, a strip step to eliminate the pressed dry film after formed bond finger in the etching step, a solder regist spread step to insulate all area except bond finger and solder boland to be formed by the strip step, a nickel/gold plating to be formed nickel/gold plating layer to do electroplating on exposed bond finger and solder boland in the solder regist spread step.