发明名称 NEGATIVE RADIATION SENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a production method by which a thick plated formed product such as a bump or wiring can be formed with good accuracy, a negative radiation sensitive resin composition suitable for the production method and excellent in sensitivity and resolution, and a transfer film using the composition. <P>SOLUTION: The negative radiation sensitive resin composition contains (A) a polymer containing a structural unit represented by formula (1) (where R<SP>1</SP>is H or methyl, R<SP>2</SP>and R<SP>3</SP>are each H, a 1-4C aliphatic hydrocarbon group, a 3-20C alicyclic hydrocarbon group, a substituted hydrocarbon group obtained by substituting a polar group other than a hydrocarbon group for at least one H atom of the aliphatic hydrocarbon group or alicyclic hydrocarbon group, or an aromatic group and may be the same or different, and R<SP>2</SP>and R<SP>3</SP>may bond to each other to form a cyclic structure containing a hetero atom), (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation sensitive radical polymerization initiator. A negative radiation sensitive resin using the composition is produced. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006285035(A) 申请公布日期 2006.10.19
申请号 JP20050106594 申请日期 2005.04.01
申请人 JSR CORP 发明人 ONIMARU NAMI;NISHIMURA YOKO;OTA KATSU;IWANAGA SHINICHIRO
分类号 G03F7/033;C08F267/10;H01L21/3205;H01L21/60;H01L23/52;H05K3/18 主分类号 G03F7/033
代理机构 代理人
主权项
地址