CONDUCTIVE FILLER AND LOW-TEMPERATURE SOLDER MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a highly heat resistant conductive filler by which fusion joining under lower temperature conditions (peak temperature≥140°C) than reflow heat treatment conditions of the conventional Sn-37Pb eutectic solder is possible. SOLUTION: The conductive filler is composed of mixtures of metal particles and has at least one of a metastable alloy phase observed as an exothermic peak in differential scanning calorimeter (DSC) and at least one of melting points observed in the exothermic peak at 110 to 140°C and at least one at 140 to 200°C and a plurality of melting points at 300 to 450°C, in which the lowest melting point after the mixture of the metal particles is fusion joined by heat treatment performed at 140 to 400°C exists at 300 to 440°C. COPYRIGHT: (C)2007,JPO&INPIT