发明名称 |
A card, a method of manufacturing the card, and a thin type battery for the card |
摘要 |
The invention provides a method of manufacturing a battery built-in type IC card which strongly resists seal breakdown of the battery in a heating and laminating process. The manufacturing method of the invention comprises a battery accommodating step of accommodating a thin type battery (1) in a cavity (79). The cavity (79) for accommodating the battery is formed by overlaying an inner sheet (73) and a first oversheet (74) on a core sheet (72) having a penetration hole (79a). A heating and laminating step involves pressing and heating from above and beneath by disposing a second oversheet (75) so as to put a lid on the cavity (79) and adhering mutually. A spacer (25) is inserted between the seal section (11) of the thin type battery (1) and second oversheet (75), and the heating and laminating step is executed so that the pressing force may be applied to the seal section (11) by way of the spacer (25). |
申请公布号 |
EP1713024(A1) |
申请公布日期 |
2006.10.18 |
申请号 |
EP20050252341 |
申请日期 |
2005.04.14 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
GOTO, TOMOHISA;HARADA, SADAMITSU |
分类号 |
G06K19/077;H01M4/00 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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