| 摘要 |
A new resin gas-assisted injection technique, which can achieve both bonding and surface modification of microfluidic devices. A sealing resin is injected with a surface modification agent into the microfluidic platform to fill the micron and submicron sized channels and reservoirs, as well as the gap between the platform and the lid. A gas (e.g., air or nitrogen) is then injected to replace most of the resin inside the channels and reservoirs. The remaining resin is cured (fully or partially) by ultraviolet light. By applying a masking technique, local modification of the channel surface can also be achieved through this method. Also provided are methods and structures related to micro-fluidic devices.
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