发明名称 Methods of forming a high germanium concentration silicon germanium alloy by epitaxial lateral overgrowth and structures formed thereby
摘要 A method of forming a high germanium concentration, low defect density silicon germanium film and its associated structures is described, comprising forming a dielectric layer on a substrate, patterning the dielectric layer to form a silicon region and at least one dielectric region, and forming a low defect silicon germanium layer on at least one dielectric region.
申请公布号 US7122392(B2) 申请公布日期 2006.10.17
申请号 US20030611042 申请日期 2003.06.30
申请人 INTEL CORPORATION 发明人 MORSE MIKE
分类号 H01L21/00;H01L21/20;H01L21/36;H01L21/762;H01L29/786;H01L31/105;H01L31/18 主分类号 H01L21/00
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