| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy-based resin composition having a good close adhesion with a lead frame consisting of a metal such as copper or nickel-plated copper, and a semiconductor device using the same. SOLUTION: This epoxy-based resin composition containing (A) an epoxy-based resin, (B) a curing agent, (C) a curing accelerator and (D) a treated inorganic filler is provided with that the (D) treated inorganic filler is the inorganic filler treated with (E) a mixed solution in advance, and the (E) mixed solution is provided by containing 0.06-0.5 pt.mass 1,8-diazabicyclo[5.4.0]undecene-7 based on 100 pts.mass solution consisting of 62-91 mass% specific silane coupling agent and 9-38 mass% ion-exchanged water having≤0.5 mS/m conductivity at 25°C and/or a lower alcohol. COPYRIGHT: (C)2007,JPO&INPIT
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