| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board excelling in its migration resistance, and to provide a manufacturing method of the wiring board. SOLUTION: In a copper-clad laminate 2, each wiring 5 made of Cu is provided on the surface of a first base material 4 via a first adhesive layer 9 or directly. In a cover lay film 3, a second adhesive layer 8 is formed on the surface of a second base material 7. The copper-clad laminate 2 and the cover lay film 3 are so superimposed on each other and so integrated with each other in the flexible printed wiring board 11 as to make the second adhesive layer 8 contact with each wiring 5 and the first adhesive layer 9. Further, each wiring 5 has an inter-metal compound layer 14 made of Cu and Sn on the surface of it contacting with the second adhesive layer 8. COPYRIGHT: (C)2007,JPO&INPIT
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