| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper base alloy which is excellent in press punching characteristics without spoiling physical properties of the material. SOLUTION: In the material for an electronic component, the copper base alloy substrate which contains an element having the standard free energy of 0.1-5.0 mass% of a carbide which is -42 kJ/mol or less at 25°C is covered with a Cu layer having a sum of the components except S of≤500 ppm, 0.5≤S≤50 ppm, a Cu purity of≤99.90%, and a thickness of 0.05-2.0μm. COPYRIGHT: (C)2007,JPO&INPIT
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